Microcertec Presents its 3-D Interconnection Cube at Photonics West this January (Y122)

Microcertec at photonics west expo in san jose, calif., this january

Chicago, (word count: 324) High-resolution images are available on request. Microcertec S.A.S combines its expertise of precision-grinding of ceramics with thin-film metallizing and laser micromachining with the aim of offering customized carriers or packaging solutions for such applications as, for instance, infrared detectors, high-power laser diodes, semiconductor lasers or LEDs. The company will present its 3-D interconnection chip carrier at Photonics West 2009 in San Jose, Calif., from Jan. 27 to 29, on the French Pavilion at booth 6142. 3-D interconnection ceramic chip carriers are smart solutions for packaging photonics devices. The chip carriers manufactured by Microcertec S.A.S prove to be smart and reliable solutions for packaging chips and integrated circuits. They enable designers to reduce the size and weight of the packaging while guaranteeing precision in positioning the electrode array. Ceramics also offer better heat dissipation, electrical insulation, and dimension stability at extreme temperatures than plastics and metals. Description of the technology: A three-dimensional ceramic body is fully machined to the required shape and tolerances. A thin metal layer is then deposited onto by vacuum thin-film deposition technology. Finally, ablation of the metal layer is operated by a micromachining laser which enables to precisely reveal the interconnection circuit. Benefits of the laser-etching technology: Compared with photolithography techniques for 2-D surfaces, laser micromachining enables the manufacturing of monolithic 3-D interconnection devices, with more flexibility and no expensive tooling. Microcertec's technology allows the production of typical runs from prototypes to a few thousands of parts per year. It also often proves to be a cheaper solution for prototypes and low-quantity batches of 2-D or 2.5-D formats because it only requires NC programming and laser processing setting. Single parts can be treated and there is usually no need for expensive fixtures. If a change in the circuit pattern is required this only implies a programming modification. Microcertec is an independent privately owned company specialized in the manufacturing of customized components in advanced ceramics using techniques of precision grinding, high-precision ultrasonic machining, laser micromachining and thin-film metallizing. For more information, please contact: MICROCERTEC Alain Charbonnier ZA Les Portes de la Fôret 47 allée du Clos des Charmes 77615 Collégien FRANCE Tel.: +33 (0)1 60 06 63 64 E-mail: alain.charbonnier@microcertec.com Web: www.microcertec.com or: FRENCH TECHNOLOGY PRESS OFFICE 205 North Michigan Avenue, Suite 3740 Chicago, IL 60601 Fax: (312) 327-5261 E-mail: contact.ftpo@ubifrance.fr