New Video Demonstrates superGRIP Heat Sink Clip-On Attachment

Advanced Thermal Solutions, Inc, has posted a new video demonstrating their latest heatsink clip-on technology: superGRIP.  superGRIP is a two-component attachment system which quickly and securely mounts heat sinks to a wide range of hot running Ball Grid Array (BGA) components, using a minimal amount of space on the PCB and eliminating the need to drill holes.

The video shows how the two-part superGRIP system’s plastic frame clip fastens securely around the perimeter of a component and a metal spring clip which slips through the heat sink’s fin field and locks securely to both ends to the plastic frame. The resulting superGRIP assembly applies steady, even pressure to the component throughout the product lifecycle, improving thermal management and long-term reliability.

ATS’ superGRIP heat sink attachment system permits the use of high performance phase changing thermal interface materials that improve heat transfer by as much
as 20 times more than typical double-sided adhesive thermal tapes. It also allows for the heat sink to be detached and reattached without damaging the electronic component or the PCB, an important feature for applications where PCB rework and ease of assembly and disassembly are important.  

The superGRIP system is available with ATS’ maxiFLOW™ family of heat sinks http://www.qats.com/Products/Heat-Sinks/BGA-Heat-Sink/1.aspx which feature a low profile, spread fin architecture to maximize surface area for more effective convection (air) cooling. Testing at an air flow rate of just 0.5 m/s (100 ft/m) shows that device junction temperatures (Tj)  can be reduced by more than 20 percent below the temperatures achieved using heat sinks with traditional fin styles.  It is also available with ATS’ straight fin and cross cut heat sinks, as well as additional sizes and configurations, as custom options.  http://www.youtube.com/watch?v=0MqyNReoo10

Name*:
E-mail*:
Captcha*:
Text*: